Electrostatic protection device

ABSTRACT

An electrostatic protection device for protecting an input port of an electronic circuit. The electrostatic protection device includes a first stacked coil, a second stacked coil, and an input terminal, wherein the second stacked coil is inductively coupled to the first stacked coil. The first stacked coil comprises a first coil input connected to the input terminal, a first coil output port connected to a lower frequency ESD protection circuit, and a first coil termination port connected to a termination load, and wherein the lower frequency ESD protection circuit comprises a lower frequency output. The second stacked coil comprises an output port connected to a higher frequency ESD protection circuit, and wherein the higher frequency ESD protection circuit comprises a higher frequency output. The electrostatic protection device comprises a summation circuit configured for outputting a summation of the higher frequency output and the lower frequency output.

BACKGROUND

The present invention relates to integrated circuits, in particular tothe electrostatic protection of input ports for integrated circuits.

Integrated circuits (ICs) may incorporate dedicated circuitry to protectthem against Electrostatic Discharge (ESD) events at their input/output(I/O) pads. The fulfillment of this ESD protection requirement may bechallenging when broadband high-frequency signals are transmitted and/orreceived across the I/O pads of the IC.

ESD protection devices in integrated circuits often comprise devicessuch as inductors and coils. As the dimensions of integrated circuitsshrink and clock rates increase, it is difficult or sometimes not evenpossible to scale the designs of ESD protection devices. Existing ESDprotection device designs often do not provide the necessary bandwidth.

SUMMARY

In one aspect the invention relates to an electrostatic protectiondevice for protecting an input port of an electronic circuit. Theelectronic protection device comprises a first stacked coil and a secondstacked coil. The first stacked coil and the second stacked coil may bestacked upon each other. Formed in an integrated circuit, the firststacked coil and the second stacked coil may be formed physically oneabove the other.

The electrostatic protection device comprises an input terminal. Thefirst stacked coil comprises a first coil input connected to the inputterminal. The first stacked coil comprises a first coil output portconnected to a lower frequency ESD protection circuit. The first stackedcoil comprises a first coil termination port connected to a terminationload. The second stacked coil is inductively coupled to the firststacked coil. The second stacked coil comprises an output port connectedto a higher frequency ESD protection circuit. The higher frequency ESDprotection circuit comprises a higher frequency output. The lowerfrequency ESD protection circuit comprises a lower frequency output. Theelectrostatic protection device comprises a summation circuit configuredfor outputting a summation of the higher frequency output and the lowerfrequency output to the input port of the electronic circuit.

According to a further aspect of the present invention, the inventionfurther provides for an integrated circuit incorporating theelectrostatic protection device for protecting an input port of anelectronic circuit.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the following, embodiments of the invention are explained in greaterdetail, by way of example only, making reference to the drawings inwhich:

FIG. 1 illustrates an example of an electrostatic protection device;

FIG. 2 illustrates an example of a first stacked coil and a secondstacked coil;

FIG. 3 shows a plot of the frequency transmission from a circuitsimulation of the electrostatic device shown in FIG. 1;

FIG. 4 illustrates the bandwidth provided by the electrostaticprotection device of FIG. 1 as observed in an eye diagram;

FIG. 5 illustrates an example of an integrated circuit;

FIG. 6 illustrates a further example of an electrostatic protectiondevice;

FIG. 7 illustrates a further example of an electrostatic protectiondevice;

FIG. 8 illustrates a further example of an electrostatic protectiondevice; and

FIG. 9 illustrates a further example of an electrostatic protectiondevice.

DETAILED DESCRIPTION

The descriptions of the various embodiments of the present inventionwill be presented for purposes of illustration but are not intended tobe exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

Embodiments of the present invention are beneficial because they providefor an effective means of increasing the bandwidth of an electrostaticprotection device. The signal is broken into lower and higher frequencycomponents which are then treated separately and then recombined. Theterms lower frequency ESD protection circuit and higher frequency ESDprotection circuit are names which are used to differentiate twoseparate ESD protection circuits. The term higher frequency output andlower frequency output are used to differentiate or name two differentfrequency outputs that are used in the circuit.

In some embodiments, both the human body model (HBM) Electro StaticDischarge (ESD) protection circuit and the charge device model (CDM) ESDprotection circuit may refer to ESD protection circuits that incorporateclamping circuits, such as diodes, connected to both of the power supplyrails (supply and ground). The HBM and CDM ESD devices may also, inpractice, incorporate a capacitance to ground that is caused by thediode junction capacitance and the parasitic wiring capacitance of thediodes, for the CDM diode, the diode junction, parasitic and the RXinput capacitance. The charge device ESD protection may furtherincorporate a resistor and/or impedance in series with an input thatlimits current and separated HBM and CDM protection circuits.

In another embodiment, the first stacked coil and the second stackedcoil form a crossover network configured to divide a signal input intothe input terminal into a higher frequency component and a lowerfrequency component. The use of the inductive circuit provides a meansfor naturally dividing the input signal into these two components. Thehigher frequency component is output by the higher frequency output andthe lower frequency output is output by the lower frequency output.

One potential advantage of this embodiment is that the higher and lowerfrequency components of an ESD event can have different amounts ofcurrent. For example, the lower frequency component of the ESD eventtypically has a higher current than the higher frequency component ofthe ESD event. This effect may be used in designing an effectiveelectrostatic protection device. The first stacked coil and the secondstacked coil may effectively form a crossover network that decouples thehigher frequency ESD protection circuit from the lower frequencycomponent of the ESD event. This may enable the higher frequency ESDprotection circuit and the lower frequency ESD protection circuit tohave their components tailored for each particular type of ESD event.For example, the higher frequency ESD protection circuit may be designedwith a lower current rating than the lower frequency ESD protectioncircuit.

In another embodiment, the first stacked coil is a t-coil with a singlecoil tap. In this embodiment, a t-coil structure is used for the lowerfrequency component. This may be beneficial because it is relativelysimple to build the t-coil with a single tap and lower frequency ESDprotection circuit so that it is able to deal with higher currents.However, this may affect the ability of it to respond to higherfrequencies. It is therefore beneficial to couple the t-coil with thehigher frequency ESD protection circuit to increase the bandwidth.

In another embodiment, the single coil tap divides the first stackedcoil into a first coil portion and a second coil portion. The singlecoil tap is the first coil output. The second coil portion is connectedbetween the single coil tap and the coil termination port. The firstcoil portion is connected between the single coil tap and the first coilinput.

In another embodiment, the inductive coupling between the first coilportion and the second stacked coil is greater than the inductivecoupling between the second coil portion and the second stacked coil.This embodiment may be beneficial during the construction of theelectrostatic protection device because the signal picked up on thefirst coil portion may be more accurate. For example, if a signal goesthrough the first coil portion and then the second coil portion, theinductance of the first coil portion may cause a degradation in the highfrequency component of the signal. Another advantage is that the currentin the first coil portion may be higher. It may therefore increase theability of the inductive coupling to take place.

In another embodiment, the second stacked coil comprises a referenceport connected to a ground plane of the electrostatic protection device.This embodiment may be beneficial because it may provide for aneffective means of referencing both the high and low frequencycomponents.

In another embodiment, the lower frequency ESD protection circuitcomprises a human body model ESD protection circuit. This may bebeneficial because the human body model ESD protection circuit can bebuilt specifically to handle the higher current and lower frequencycomponent of an ESD event.

In another embodiment, the lower frequency ESD protection circuitcomprises an additional charge device model ESD protection circuit. Thevarious frequency components may be divided into upper, higher and lowerportions but there may still be some portion of the higher frequencycomponent of the ESD pulse that goes through the first stacked coil.Incorporating the additional charge device model ESD protection circuitmay therefore be beneficial and increase the effectiveness of the ESDprotection.

In another embodiment, the first stacked coil comprises a first coil tapand a second coil tap. The lower frequency ESD protection circuit isconnected to the first coil tap and the second coil tap. This embodimentis similar to a t-coil arrangement, but instead of the first stackedcoil being divided into two parts, it is divided into three parts. Thismay allow for a more sophisticated lower frequency ESD protectioncircuit.

In another embodiment, the first stacked coil comprises a first coilportion, an intermediate coil portion, and a second coil portion. Thefirst coil portion is connected between the first coil input and thefirst coil tap. The intermediate coil portion is connected between thefirst coil tap and the second coil tap. The second coil portion isconnected between the second coil tap and the first coil terminationport.

In another embodiment, the lower frequency ESD protection circuitcomprises a human body model ESD protection circuit. The lower frequencyESD protection comprises an additional charge device model ESDprotection circuit. The additional charge device model ESD protectioncircuit is connected to the first coil tap and the human body model ESDprotection circuit is connected to the second coil tap. This embodimentmay be beneficial because it provides for a very effective ESDprotection for lower frequencies.

In another embodiment, the second stacked coil comprises a referenceport connected to a ground plane of the electrostatic protection device.

In another embodiment, the second stacked coil comprises a referenceport connected to the second coil tap.

In another embodiment, the first stacked coil is at least partiallyformed from the top two metallization layers of the electrostaticprotection device. This may be beneficial because the currents goingthrough the first stacked coil may be larger than through the secondstacked coil. The top two metallization layers of the electrostaticprotection device may be thicker and provide for a first stacked coilthat is less likely to be destroyed by an ESD event and have a lowerresistance.

In another embodiment, the higher frequency ESD protection circuitcomprises a primary charge device model ESD protection circuit. The useof the terms primary charge device model ESD protection circuit andadditional charge device model ESD protection circuit are intended toindicate that there are two separate charge device model ESD protectioncircuits.

In another embodiment, the primary charge device model ESD protectioncircuit has a primarily reactive impedance. Because the signal from theESD event has been divided effectively into two with the higherfrequency component having a lower current, the primary charge devicemodel ESD protection circuit can be specialized and designed in a way sothat there is less power loss. In a conventional electrostaticprotection device, the primary charge device model ESD protectioncircuit uses diodes that for smaller signals are effectively lossycapacitors. However, for larger voltages, the diodes begin to conductand effectively provide a resistance which dissipates the ESD energy toground. A reactive impedance may be used for the ESD protection circuitinstead, as the data signal for higher frequency and low frequency ESDprotection circuit are lower current.

In another embodiment, the summation circuit may be a continuous timelinear equalizer circuit. For example, this may be a particularlyeffective way of combining the low and high frequency signal components.

In another embodiment, the input port of the electronic circuit is adifferential input port. The differential input port is formed by twoelectrostatic protection devices connected together via the continuoustime linear equalization circuit. The continuous time linearequalization circuit is used to combine the signals from two separateelectrostatic protection devices. This may be beneficial because it mayprovide for better rejection of noise.

In another embodiment, the termination load is resistive. This, forexample, may provide for an effective means of constructing the circuit.

In another aspect, the invention provides for an integrated circuit thatcomprises an electronic circuit. The integrated circuit comprises anelectrostatic protection device for protecting the input port of theelectronic circuit. The electrostatic protection device comprises afirst stacked coil and a second stacked coil. The electrostaticprotection device comprises an input terminal. The first stacked coilcomprises a first coil input connected to the input terminal. The firststacked coil comprises a first coil output port connected to a lowerfrequency ESD protection circuit. The first stacked coil comprises afirst coil termination port connected to a termination load. The secondstacked coil is inductively coupled to the first stacked coil. Thesecond stacked coil comprises an output port connected to a higherfrequency ESD protection circuit. The higher frequency ESD protectioncircuit has a higher frequency output. The lower frequency ESDprotection circuit has a lower frequency output. The electrostaticprotection device comprises a summation circuit configured foroutputting a summation of the higher frequency output and the lowerfrequency output to the input port of the electronic circuit.

In another embodiment, the integrated circuit may be any of thefollowing: a microprocessor, a microcontroller, a graphical processingunit, a central processing unit, a wideband amplifier, ananalogue-to-digital converter, a digital-to-analogue converter, awireline transceiver circuit, and a telecommunications chip.

In another embodiment, the integrated circuit comprises a substrate. Theelectronic circuit is formed on the substrate. The electrostaticprotection device is also formed on the substrate. The second stackedcoil is formed closer to the substrate than the first stacked coil.This, for example, may be beneficial because thicker metal layers suchas the final few metallization layers can be used for forming the firststacked coil. This may provide for a higher current rating and a lowerresistance for the lower frequency EDS protection circuit.

FIG. 1 illustrates an example of an electrostatic protection device 100.The electrostatic protection device 100 has an input port 102. The inputport 102 may be the input port for an electronic circuit that it isprotecting. The electrostatic protection device 100 comprises a firststacked coil 104 and a second stacked coil 106. In this example, thefirst stacked coil 104 is divided into a first coil portion 110 and asecond coil portion 112. There is a single coil tap 114 between thefirst coil portion 110 and the second coil portion 112. The firststacked coil 104 and the second stacked coil 106 are physically stackedupon each other such that the first stacked coil 104 and the secondstacked coil 106 have an inductive coupling. In this particular figure,it is shown that the second stacked coil 106 is coupling predominantlyto the first coil portion 110. This is however just one option. It couldalso couple primarily to the second coil portion 112.

The first stacked coil and the second stacked coil 104, 106 form afive-port device. The first port 120 is a first coil input. The secondport 122 is a first coil output port and is the same as the single coiltap 114. The third port 124 is connected to the output of the secondcoil portion 112 and is connected to a termination load 116. The fourthport is a reference port 126 that is connected to one end of the secondstacked coil 106 and the fifth port is a second coil output port 128that is the other port of the second stacked coil 106.

The inductive coupling between the second stacked coil 106 and the firststacked coil 104 is configured such that it preferentially couples thehigh frequency component of a signal to a higher frequency ESDprotection circuit 140. The uncoupled portion of the signal remains inthe lower frequency ESD protection circuit 130. This therefore forms ahigher frequency circuit path 142 and a lower frequency circuit path132. The lower frequency circuit path 132 has a human body model ESDprotection circuit 134 and an additional charge device model ESDprotection circuit 136. The higher frequency circuit path 142 has aprimary charge device model ESD protection circuit 144.

Both the higher frequency ESD protection circuit 140 and the lowerfrequency ESD protection circuit 130 are coupled to a summation circuit150 through an amplifier. The summation circuit 150 sums a lowerfrequency output 154 and a higher frequency output 156 to anelectrostatic protection device output 152 which has a summation 158 ofboth the lower frequency output 154 and the higher frequency output 156.This is illustrated by the graphs of the lower frequency signal and thehigher frequency signal as shown in the plot.

FIG. 2 shows an example of the first stacked coil 104 and the secondstacked coil 106. This figure shows a perspective view 200 and a topview 202. The figures show the first coil portion 110 and second coilportion 112 of the first stacked coil 104 on top of the second stackedcoil 106. In this example, the second coil portion 112 is adjacent tothe second stacked coil 106. The inductive coupling is likely strongerbetween the second stacked coil 106 and the second coil portion 112 thanbetween the second stacked coil 106 and the first coil portion 110. Thisis the opposite of the situation that is illustrated in FIG. 1 where thedrawing shows that the inductive coupling is primarily between the firstcoil portion 110 and the second stacked coil 106. The design in FIG. 2could be readily modified to match what is illustrated in FIG. 1 bymechanically switching the position of the two coil portions 112 and110. The coils illustrated in FIG. 2 could for example readily bemanufactured using standard semiconductor manufacturing techniques.

FIG. 3 shows the frequency transmission from a simulation of the circuitillustrated in FIG. 1. The lower frequency output 154 and the higherfrequency output 156 are plotted. The low band −3 dB point 300 is shown.The summation of both signals is illustrated by summation 158. The −3 dBpoint for the summation 158 is illustrated by the line 302. Incomparison with the low band −3 dB point 300 the −3 dB point for thesummation of the signals is greatly increased.

FIG. 4 illustrates the bandwidth provided by the electrostatic device ofFIG. 1. There are two groups of figures. The figures in column 400represent the actual signals. The figures in column 402 are eyediagrams. Row 1 404 contains the higher frequency band. Row 2 is thelower frequency band 406. The lowest row 408 contains the summation ofthe higher frequency band 404 and the lower frequency band 406. Thecolumn 402 for the summation shows a relatively large bandwidth.

FIG. 5 illustrates an example of an integrated circuit 500. Theintegrated circuit 500 comprises a substrate 502. There is an input pad504 on the substrate 502. This is then wire bonded 506 to the input port102. The first stacked coil 104 and second stacked coil 106, as isillustrated in FIG. 2, form part of the integrated circuit 500. Theintegrated circuit 500 comprises the electrostatic protection device 100and forms the input for an electronic circuit 508. The first coilportion 110 and the second coil portion 112 are formed from the top twometallization layers 510. This enables these two portions 110, 112 tohave a higher current rating and better withstand an ESD event.

FIG. 6 illustrates a further example of an electrostatic protectioncircuit 600. The electrostatic protection circuit 600 in FIG. 6 issimilar to that as was illustrated in FIG. 1. In this example, thesummation circuit is a continuous time linear equalizer circuit 150′.The continuous time linear equalizer circuit 150′ comprises an amplifier602, a FET transistor 601, and several resistors 604. The resistances ofresistors 604 can be adjusted so that the attenuation of the HF path 142matches the amplitude of LF path 132. In the LF path 132, due to thefeedback loop built of the amplifier 602 and the FET transistor 601, avirtual ground is formed 606. This forms a transimpedance amplifier(current to voltage amplifier). The LF 154 and the HF 156 signals areadded at the bottom of the FET transistor 601 and the output 152connects to a next stage, such as an analog to digital converter (ADC).

FIG. 7 illustrates a further example of a differential electrostaticprotection device 700. There is a first differential input 702 and asecond differential input 704. The first differential input 702 isconnected to a first electrostatic protection device 706 which issimilar to the electrostatic protection device 100 illustrated inFIG. 1. The second differential input 704 is connected as the input fora second electrostatic protection device 708. Likewise, the secondelectrostatic protection device 708 is similar to the electrostaticprotection device 100 illustrated in FIG. 1.

The first electrostatic protection device 706 and the secondelectrostatic protection device 708 have some modifications with respectto the electrostatic protection device 100 of FIG. 1. Firstly, thesecond stacked coil 106 is shown as primarily coupling to the secondcoil portion 112 in both cases. The first electrostatic protectiondevice 706 and the second electrostatic protection device 708 are shownas being connected and providing a differential summation using acontinuous time linear actuator circuit 150″.

The continuous time linear actuator circuit 150″ is a differentialamplifier in this example, with two FETs 710 with a resistor 712 attheir drains. VDD (DC voltage) is supplied trough the inductors L3. Thehigh frequency output 156 reaches the output (to next stage) via thedrain resistors 712 where it is combined with the low frequency output154 slightly amplified by the FETs 710. A current source is typical fordifferential amplifiers. The adjustable resistors 714, are configured totune the circuit in order for the signal amplitude of the high and lowfrequency channel to match. Capacitor 716 between the two VDDs is justto block the power supply.

FIG. 8 illustrates a further example of an electrostatic protectiondevice 800. In this example the first stacked coil 104 has been modifiedwith respect to the example illustrated in FIG. 1. The first stackedcoil 104 has been divided into three parts, a first coil portion 110, anintermediate coil portion 802 and a second coil portion 112. There is afirst coil output port 122 between the first coil portion 110 and theintermediate coil portion 802. There is a sixth port 806 which isprovided by a second coil tap 804. The second coil tap 804 is betweenthe intermediate coil portion 802 and the second coil portion 112. Thefirst stacked coil 104 and the second stacked coil 106 therefore form asixth port device in this example. The example in FIG. 8 is furthermodified from that which is shown in FIG. 1 in that the additionalcharge device model ESD protection circuit 136 is shown as beingconnected to the second port or the first coil output port 122. Thehuman body model ESD protection circuit 134 is shown as being connectedto what is the sixth port or the second coil output port 806. In thecircuit diagram the second stacked coil 106 is shown as couplingpredominantly to the intermediate coil portion 802. However, this couldbe modified and the second stacked coil 106 could also predominantlycouple to the first coil portion 110 or the second coil portion 112.

FIG. 9 shows a further example of an electrostatic protection device900. The example illustrated in FIG. 9 is very similar to the exampleillustrated in FIG. 8 with a modification. In FIG. 8 the fourth port orthe reference port 126 of the second stacked coil 106 was connected to aground. In the example in FIG. 9 the fourth port or reference port 126is instead connected to the second coil tap 804. This is equivalent tothe second coil output port 806 being connected to the reference port126 of the second stacked coil 106.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. An electrostatic protection device for protecting an input port of an electronic circuit, the electrostatic protection device comprising: a first stacked coil, a second stacked coil, and an input terminal, wherein the second stacked coil is inductively coupled to the first stacked coil; wherein the first stacked coil comprises a first coil input connected to the input terminal, a first coil output port connected to a lower frequency ESD protection circuit, and a first coil termination port connected to a termination load, and wherein the lower frequency ESD protection circuit comprises a lower frequency output; wherein the second stacked coil comprises an output port connected to a higher frequency ESD protection circuit, and wherein the higher frequency ESD protection circuit comprises a higher frequency output; and wherein the electrostatic protection device comprises a summation circuit configured for outputting a summation of the higher frequency output and the lower frequency output to the input port of the electronic circuit.
 2. The electrostatic protection device of claim 1, wherein the first stacked coil and the second stacked coil form a crossover network configured to divide a signal input into the input terminal into a higher frequency component and a lower frequency component, wherein the higher frequency component being output by the higher frequency output and the lower frequency component being output by the lower frequency output.
 3. The electrostatic protection device of claim 1, wherein the first stacked coil is a T-coil with a single coil tap.
 4. The electrostatic protection device of claim 3, wherein the single coil tap divides the first stacked coil into a first coil portion and a second coil portion, the single coil tap is the first coil output, the second coil portion being connected between the single coil tap and the coil termination port, and the first coil portion being connected between the single coil tap and the first coil input.
 5. The electrostatic protection device of claim 4, wherein an inductive coupling between the first coil portion and the second stacked coil is greater than the inductive coupling between the second coil portion and the second stacked coil.
 6. The electrostatic protection device of claim 5, wherein the second stacked coil comprises a reference port connected to a ground plane of the electrostatic protection device.
 7. The electrostatic protection device of claim 1, wherein the lower frequency ESD protection circuit comprises a human body model ESD protection circuit.
 8. The electrostatic protection device of claim 7, wherein the lower frequency ESD protection comprises an additional charge device model ESD protection circuit.
 9. The electrostatic protection device of claim 1, wherein the first stacked coil comprises a first coil tap and a second coil tap, and the lower frequency ESD protection circuit is connected to the first coil tap and the second coil tap.
 10. The electrostatic protection device of claim 9, wherein the first stacked coil comprises a first coil portion, an intermediate coil portion, and a second coil portion, wherein the first coil portion is connected between the first coil input and the first coil tap, the intermediate coil portion is connected between the first coil tap and the second coil tap, and the second coil portion is connected between the second coil tap and the first coil termination port.
 11. The electrostatic protection device of claim 10, wherein the lower frequency ESD protection circuit comprises a human body model ESD protection circuit, the lower frequency ESD protection comprising an additional charge device model ESD protection circuit, the additional charge device model ESD protection circuit is connected to the first coil tap, and the human body model ESD protection circuit is connected to the second coil tap.
 12. The electrostatic protection device of claim 1, wherein the second stacked coil comprises a reference port connected to a ground plane of the electrostatic protection device.
 13. The electrostatic protection device of claim 1, wherein the second stacked coil comprising a reference port is connected to the second coil tap.
 14. The electrostatic protection device of claim 1, wherein the first stacked coil is at least partially formed from a top two metallization layers of the electrostatic protection device.
 15. The electrostatic protection device of claim 1, wherein the higher frequency ESD protection circuit comprises a primary charge device model ESD protection circuit.
 16. The electrostatic protection device of claim 15, wherein the primary charge device model ESD protection circuit has a primarily reactive impedance.
 17. The electrostatic protection device of claim 1, wherein the summation circuit is a Continuous Time Linear Equalizer circuit.
 18. The electrostatic protection device of claim 17, wherein the input port of the electronic circuit is a differential input port, where the differential input port is formed by two electrostatic protection devices connected together via the continuous time linear equalizer circuit.
 19. The electrostatic protection device of claim 1, wherein the summation circuit is formed from a summing amplifier.
 20. The electrostatic protection device of claim 1, wherein the termination load is resistive.
 21. An integrated circuit comprising an electronic circuit, the integrated circuit comprising an electrostatic protection device for protecting an input port of the electronic circuit, the electrostatic protection device comprising: a first stacked coil, a second stacked coil, and an input terminal, wherein the second stacked coil is inductively coupled to the first stacked coil; wherein the first stacked coil comprises a first coil input connected to the input terminal, a first coil output port connected to a lower frequency ESD protection circuit, and a first coil termination port connected to a termination load, and wherein the lower frequency ESD protection circuit comprises a lower frequency output; wherein the second stacked coil comprises an output port connected to a higher frequency ESD protection circuit, and wherein the higher frequency ESD protection circuit comprises a higher frequency output; and wherein the electrostatic protection device comprises a summation circuit configured for outputting a summation of the higher frequency output and the lower frequency output to the input port of the electronic circuit.
 22. The integrated circuit of claim 21, wherein the integrated circuit is selected from a group consisting of: a microprocessor, a microcontroller, a graphical processing unit, a central processing unit, wide band amplifier, analog to digital converter, digital to analog converter, wireline transceiver circuit, and a telecommunications chip.
 23. The integrated circuit of claim 21, wherein the integrated circuit comprises a substrate, the electronic circuit being formed on the substrate, the electrostatic protection device being formed on the substrate, and the second stacked coil being formed closer to the substrate than the first stacked coil. 